Thermal simulation of flexible LED package enhanced with copper pillars

Author： Yang Liu   Leung Stanley Y. Y.   Wong Cell K.Y.   Yuan Cadmus A.   Guoqi Zhang   Fenglian Sun  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.36, Iss.6, 2015-06, pp. : 64011-64014

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Thermal analysis of LED package

By Karim N. Aizar Abdul   Narayana P.A. Aswatha   Seetharamu K.N.  

Microelectronics International, Vol. 23, Iss. 1, 2006-01 ,pp. : 19-25

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Thermal analysis of LED lamp with LTCC-COB package

By Lee Chang Keun   Ahn Jung Keun   Lee Cheul Ro   Kim Daesuk   Baek Byung Joon  

Microelectronics International, Vol. 30, Iss. 1, 2013-01 ,pp. : 3-9

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Electro-Thermal Simulation with the SISSI Package

By Sze´kely V.  

Analog Integrated Circuits and Signal Processing, Vol. 21, Iss. 1, 1999-10 ,pp. : 21-31

Springer Publishing Company

Access to resources Recommend Favorite

Thermal performance of a low-cost thermal enhanced plastic ball grid array package - NuBGA

By Lau John H   Chen K.L.   Wu F  

Microelectronics International, Vol. 15, Iss. 2, 1998-02 ,pp. : 25-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

By Liu Yang   Sun Fenglian   Yuan Cadmus A.   Zhang Guoqi  

Microelectronics International, Vol. 33, Iss. 1, 2016-01 ,pp. : 42-46

Emerald Group Publishing Ltd

Access to resources Recommend Favorite