Transient thermal analysis as measurement method for IC package structural integrity

Author： Alexander Hanß   Maximilian Schmid   E Liu   Gordon Elger  

Publisher： IOP Publishing

E-ISSN： 1741-4199|24|6|68105-68122

ISSN： 1674-1056

Source： Chinese Physics B, Vol.24, Iss.6, 2015-06, pp. : 68105-68122

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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