Eliminating Voids at Al2O3–Cu Interface During Direct Bonding

Publisher: John Wiley & Sons Inc

E-ISSN: 1744-7402|12|5|1020-1026

ISSN: 1546-542x

Source: INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, Vol.12, Iss.5, 2015-09, pp. : 1020-1026

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