Effect of Grain Size on the Spall Fracture Behaviour of Pure Copper under Plate‐Impact Loading

Publisher： John Wiley & Sons Inc

E-ISSN： 1475-1305|51|3|190-197

ISSN： 0039-2103

Source： STRAIN (ELECTRONIC), Vol.51, Iss.3, 2015-06, pp. : 190-197

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