An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations

Author： Yang Shaorui   Qu Jianmin  

Publisher： IOP Publishing

ISSN： 0965-0393

Source： Modelling and Simulation in Materials Science and Engineering, Vol.22, Iss.6, 2014-09, pp. : 65011-65031

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