Molecular dynamics simulation of diffusion bonding of Al–Cu interface

Author： Li Chang   Li Dongxu   Tao Xiaoma   Chen Hongmei   Ouyang Yifang  

Publisher： IOP Publishing

ISSN： 0965-0393

Source： Modelling and Simulation in Materials Science and Engineering, Vol.22, Iss.6, 2014-09, pp. : 65013-65023

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