A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board

Author： Leung E.S.W. Yung W.K.C. Lee W.B.

ISSN： 0268-3768

Source： The International Journal of Advanced Manufacturing Technology, Vol.24, Iss.7-8, 2004-10, pp. : 474-484

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