Process optimisation of transfer moulding for electronic packages using artificial neural networks and multiobjective optimisation techniques

Author: Tong K.W.   Kwong C.K.   Yu K.M.  

Publisher: Springer Publishing Company

ISSN: 0268-3768

Source: The International Journal of Advanced Manufacturing Technology, Vol.24, Iss.9-10, 2004-11, pp. : 675-685

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next