An environmental assessment model applied to printed circuit board manufacturing

Author： Hui I.  

Publisher： Springer Publishing Company

ISSN： 0268-3768

Source： The International Journal of Advanced Manufacturing Technology, Vol.32, Iss.7-8, 2007-04, pp. : 834-842

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Printed circuit board recycling process and its environmental impact assessment

By Xiang Dong   Mou Peng   Wang Jinsong   Duan Guanghong   Zhang Hong  

The International Journal of Advanced Manufacturing Technology, Vol. 34, Iss. 9-10, 2007-10 ,pp. : 1030-1036

Springer Publishing Company

Access to resources Recommend Favorite

Experimental studies on cryogenic recycling of printed circuit board

By Yuan Chris   Zhang Hong   McKenna Gregory   Korzeniewski Carol   Li Jianzhi  

The International Journal of Advanced Manufacturing Technology, Vol. 34, Iss. 7-8, 2007-10 ,pp. : 657-666

Springer Publishing Company

Access to resources Recommend Favorite

A DMAIC approach to printed circuit board quality improvement

By Tong J.   Tsung F.   Yen B.  

The International Journal of Advanced Manufacturing Technology, Vol. 23, Iss. 7-8, 2004-04 ,pp. : 523-531

Springer Publishing Company

Access to resources Recommend Favorite

Workload balancing in printed circuit board assembly

By Emet Stefan   Knuutila Timo   Alhoniemi Esa   Maier Michael   Johnsson Mika   Nevalainen Olli  

The International Journal of Advanced Manufacturing Technology, Vol. 50, Iss. 9-12, 2010-10 ,pp. : 1175-1182

Springer Publishing Company

Access to resources Recommend Favorite

Numerical investigation on the thermal reliability and layout optimisation of printed circuit board level

By Xi Tao  

International Journal of Materials and Structural Integrity, Vol. 6, Iss. 2-4, 2012-10 ,pp. : 309-318

Inderscience Publishers

Access to resources Recommend Favorite