Investigation of O2 and SF6 plasma interactions on thermally stable damage resistant poly phenyl-methyl silsesquioxane low-k films

Author: Cherunilam J F   Rajani K V   McCoy A   Heise A   Daniels S  

Publisher: IOP Publishing

ISSN: 0022-3727

Source: Journal of Physics D: Applied Physics, Vol.47, Iss.10, 2014-03, pp. : 105204-105208

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