Influences of triple junctions on stress-assisted grain boundary motion in nanocrystalline materials

Author: Aramfard Mohammad   Deng Chuang  

Publisher: IOP Publishing

ISSN: 0965-0393

Source: Modelling and Simulation in Materials Science and Engineering, Vol.22, Iss.5, 2014-07, pp. : 55012-55028

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next