Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits

Author： Li-Bo Qian   Zhang-Ming Zhu   Yin-Shui Xia   Rui-Xue Ding   Yin-Tang Yang  

Publisher： IOP Publishing

ISSN： 1674-1056

Source： Chinese Physics B, Vol.23, Iss.3, 2014-03, pp. : 38402-38407

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