The density and surface tension of In–Sn and Cu–In–Sn alloys

Author： Guo Zhongnan Hindler Michael Yuan Wenxia Mikula Adolf

ISSN： 0026-9247

Source： Monatshefte für Chemie / Chemical Monthly, Vol.142, Iss.6, 2011-06, pp. : 579-584

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

Materials Science Forum, Vol. 2015, Iss. 830, 2015-10 ,pp. : 265-269

Trans Tech Publications

Access to resources Recommend Favorite

Suppression of Cu₃Sn with Ni in High Cu Containing Sn-Cu Solder Alloys

Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 53-57

Trans Tech Publications

Access to resources Recommend Favorite

Mechanical properties of rapidly solidified of Cu-Sn shape memory alloys

By Kamal Mustafa

Radiation Effects and Defects in Solids, Vol. 161, Iss. 3, 2006-03 ,pp. : 189-191

Taylor & Francis Ltd

Access to resources Recommend Favorite

Influence of Cu Doping on Martensitic and Magnetic Transitions in Ni-Mn-Sn Alloys

Materials Science Forum, Vol. 2016, Iss. 879, 2017-02 ,pp. : 1123-1128

Trans Tech Publications

Access to resources Recommend Favorite

Influence of Dislocation Density on Micromechanical Characteristics of Cu₆Sn₅ and Cu₃Sn

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 115-124

Trans Tech Publications

Access to resources Recommend Favorite