Adhesion Improvement via Surface Functionalization of Epoxy‐Resin Base Post by Low Temperature Plasma

Publisher: John Wiley & Sons Inc

E-ISSN: 1521-3900|354|1|13-20

ISSN: 1022-1360

Source: MACROMOLECULAR SYMPOSIA (ELECTRONIC), Vol.354, Iss.1, 2015-08, pp. : 13-20

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Abstract