Effects of temperature and voids on the interfacial fracture of Si/a‐Si3N4 bilayer systems

Publisher: John Wiley & Sons Inc

E-ISSN: 1521-3951|252|9|2013-2019

ISSN: 0370-1972

Source: PHYSICA STATUS SOLIDI (B) BASIC SOLID STATE PHYSICS, Vol.252, Iss.9, 2015-09, pp. : 2013-2019

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Abstract