An alternative empirical model for the relationship between the bond valence and the thermal expansion rate of chemical bonds

Publisher： John Wiley & Sons Inc

E-ISSN： 2052-5206|71|4|484-487

ISSN： 2052-5192

Source： ACTA CRYSTALLOGRAPHICA SECTION B (ELECTRONIC), Vol.71, Iss.4, 2015-08, pp. : 484-487

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