Author: Catelani M. Scarano V.L. Berni R.
Publisher: Edp Sciences
E-ISSN: 2107-6847|4|1|47-54
ISSN: 2107-6839
Source: International Journal of Metrology and Quality Engineering, Vol.4, Iss.1, 2013-06, pp. : 47-54
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Effects of voids on thermal-mechanical reliability of lead-free solder joints
MATEC Web of conference, Vol. 12, Iss. issue, 2014-06 ,pp. :
High temperature indentation behavior of eutectic lead-free solder materials
By Müllera W.H.
EPJ Web of Conference, Vol. 6, Iss. issue, 2010-06 ,pp. :
Composite material characterization through biaxial testing of cruciform specimens
By Ramault C.
EPJ Web of Conference, Vol. 6, Iss. issue, 2010-06 ,pp. :