A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads

Author: Johansson Jonas   Belov Ilja   Johnson Erland   Leisner Peter  

Publisher: Emerald Group Publishing Ltd

ISSN: 0264-4401

Source: Engineering Computations: Int J for Computer-Aided Engineering, Vol.31, Iss.3, 2014-04, pp. : 467-489

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