Related content

3 Laser transmission joining in microtechnology

By Haberstroh Edmund   Hoffmann Wolf-Martin   Poprawe Reinhart   Sari Fahri  

Microsystem Technologies, Vol. 12, Iss. 7, 2006-06 ,pp. : 632-639

Springer Publishing Company

Access to resources Recommend Favorite

High power diode laser transmission welding of plastics

By Bryden Brian  

Assembly Automation, Vol. 20, Iss. 2, 2000-06 ,pp. : 136-139

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Influences of interface oxidation on transmission laser bonding of wafers for microsystem packaging

By Tseng Ampere   Park Jong-Seung   Vakanas George   Wu Hongtao   Raudensky Miroslav   Chen T.  

Microsystem Technologies, Vol. 13, Iss. 1, 2007-01 ,pp. : 49-59

Springer Publishing Company

Access to resources Recommend Favorite

Joining using adhesives

By Adams R.D.   Comyn J.  

Assembly Automation, Vol. 20, Iss. 2, 2000-06 ,pp. : 109-117

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Joining specification statements

By Rustan K.   Leino M.   Manohar R.  

Theoretical Computer Science, Vol. 216, Iss. 1, 1999-03 ,pp. : 375-394

Elsevier

Access to resources Recommend Favorite