Role of surfactants in construction of porous copper film by electrodeposition approach

Author: Wang N   Hu W C   Lu Y H   Deng Y F   Wan X B   Zhang Y W   Du K   Zhang L  

Publisher: Maney Publishing

ISSN: 0020-2967

Source: Transactions of the Institute of Metal Finishing, Vol.89, Iss.5, 2011-09, pp. : 261-267

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next