Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates

Author： Ashworth M A   Wilcox G D   Higginson R L   Heath R J   Liu C  

Publisher： Maney Publishing

ISSN： 0020-2967

Source： Transactions of the Institute of Metal Finishing, Vol.91, Iss.5, 2013-09, pp. : 260-268

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