Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

Author： Itou Shouetsu  

Publisher： Taylor & Francis Ltd

ISSN： 0149-5739

Source： Journal of Thermal Stresses, Vol.37, Iss.6, 2014-06, pp. : 749-770

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