FSI Analysis of the Effect of Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|786|361-366

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.786, 2015-09, pp. : 361-366

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