Numerical Analysis of Slurry Flow and Contact Pressure in CMP Considering the Effects of Retaining Ring

Publisher: Trans Tech Publications

E-ISSN: 1662-8985|2015|806|338-342

ISSN: 1022-6680

Source: Advanced Materials Research, Vol.2015, Iss.806, 2015-12, pp. : 338-342

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract