Thermal Stress Cleaving of Si-Wafer: Investigation of Fracture Initiation during Laser Beam Irradiation

Publisher: Trans Tech Publications

E-ISSN: 1662-8985|2015|1101|412-418

ISSN: 1022-6680

Source: Advanced Materials Research, Vol.2015, Iss.1101, 2015-05, pp. : 412-418

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Abstract