Electroless plating of carbon nanotubes with silver

By Feng Yi   Yuan Hailong  

Journal of Materials Science, Vol. 39, Iss. 9, 2004-05 ,pp. : 3241-3243

Springer Publishing Company

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Enhancing the Adhesion Strength Between Cu Substrate and Ni Layer in Microelectroforming

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Materials and Manufacturing Processes, Vol. 29, Iss. 7, 2014-07 ,pp. : 795-800

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High electrical conductivity and high corrosion resistance fibers with high modulus and high strength prepared by electroless plating of gold on the surface of poly (p-phenylene benzobisoxazole) (PBO)

By Ishikawa Hisako   Chen Qingyun   Bin Yuezhen   Komatsu Kaori   Matsuo Masaru  

Journal of Materials Science, Vol. 42, Iss. 18, 2007-09 ,pp. : 7772-7779

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Effect of Grinding on the Residual Stress and Adhesion Strength of HVOF Thermally Sprayed WC–10Co–4Cr Coating

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Materials and Manufacturing Processes, Vol. 29, Iss. 9, 2014-09 ,pp. : 1139-1151

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Preparation and Characterization of Activated Carbon/Cu Catalyst by Electroless Copper Plating for Removal of NO

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Journal of Porous Materials, Vol. 11, Iss. 1, 2004-01 ,pp. : 15-19

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