Seebeck Coefficient of Ge-on-Insulator Layers Fabricated by Direct Wafer Bonding Process

Publisher: Trans Tech Publications

E-ISSN: 1662-8985|2015|1117|94-97

ISSN: 1022-6680

Source: Advanced Materials Research, Vol.2015, Iss.1117, 2015-08, pp. : 94-97

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract