A Dual Boundary Element Model for Electromechanical Impedance Based Damage Detection Applications

Publisher： Trans Tech Publications

E-ISSN： 1662-9795|2015|665|265-268

ISSN： 1013-9826

Source： Key Engineering Materials, Vol.2015, Iss.665, 2016-01, pp. : 265-268

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Dual Boundary Element Model of 3D Piezoelectric Smart Structures

By  

Key Engineering Materials, Vol. 2017, Iss. 754, 2017-10 ,pp. : 363-366

Trans Tech Publications

Access to resources Recommend Favorite

Electro-Mechanical Impedance Measurements as a Possible SHM Method for Sandwich Debonding Detection

By  

Key Engineering Materials, Vol. 2017, Iss. 742, 2017-08 ,pp. : 763-777

Trans Tech Publications

Access to resources Recommend Favorite

Uncertainty and sensitivity analysis of electro-mechanical impedance based SHM system

By  

IOP Conference Series: Materials Science and Engineering, Vol. 10, Iss. 1, 2010-06 ,pp. : 1977-1985

IOP Publishing

Access to resources Recommend Favorite

An enriched Dual Boundary Element Method for Fracture Mechanics

By  

IOP Conference Series: Materials Science and Engineering, Vol. 10, Iss. 1, 2010-06 ,pp. : 408-414

IOP Publishing

Access to resources Recommend Favorite

Wave propagation numerical models in damage detection based on the time domain spectral element method

By  

IOP Conference Series: Materials Science and Engineering, Vol. 10, Iss. 1, 2010-06 ,pp. : 602-611

IOP Publishing

Access to resources Recommend Favorite