The Effect of Thickness and Annealing Time on Surface Segregation in Cu/Ni, Ni/Cu Film/Substrate and Cu/Ni/Si Film/Film/Substrate

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2015|833|181-184

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2015, Iss.833, 2015-12, pp. : 181-184

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Abstract