Interfacial Wettability and Thermal Conductivity of Diamond/Al Based Composites with Ti and B Additions
Publisher： Trans Tech Publications
E-ISSN： 1662-9752|2015|816|169-176
ISSN： 0255-5476
Source： Materials Science Forum, Vol.2015, Iss.816, 2015-05, pp. : 169-176
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