Publisher: IOP Publishing
E-ISSN: 1757-899X|108|1|73-80
ISSN: 1757-899X
Source: IOP Conference Series: Materials Science and Engineering, Vol.108, Iss.1, 2016-03, pp. : 73-80
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content
Elution of copper from vermiculite with environmentally benign reagents
Hydrometallurgy, Vol. 70, Iss. 1, 2003-07 ,pp. :
Performance Analysis of IIUM Wireless Campus Network
IOP Conference Series: Materials Science and Engineering, Vol. 53, Iss. 1, 2013-12 ,pp. :
Ceramic-Polymer Composites with Low Dielectric Loss for Microwave Antennas and Wireless Sensors
Key Engineering Materials, Vol. 2015, Iss. 655, 2015-08 ,pp. :