Stochastic Simulation of Tape Grinding for Wafer-Like Workpiece

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2016|874|91-96

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2016, Iss.874, 2016-11, pp. : 91-96

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract