A fabrication process based on structural layer formation using Au–Au thermocompression bonding for RF MEMS capacitive switches and their performance
Publisher： Cambridge University Press
E-ISSN： 1759-0795|6|5|473-480
ISSN： 1759-0787
Source： International Journal of Microwave and Wireless Technologies, Vol.6, Iss.5, 2014-10, pp. : 473-480
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