Study of the Interaction of Copper Nanoparticles with Titanium in Landfill Soils Layers

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2016|869|778-783

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2016, Iss.869, 2016-10, pp. : 778-783

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Abstract