Low-temperature conduction mechanisms of 3-nm-thick post-soft breakdown SiO2 films

Publisher: Edp Sciences

E-ISSN: 1764-7177|12|3|103-106

ISSN: 1155-4339

Source: Le Journal de Physique IV, Vol.12, Iss.3, 2002-05, pp. : 103-106

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next