Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire

Publisher： Edp Sciences

E-ISSN： 1764-7177|05|C3|C3-273-C3-278

ISSN： 1155-4339

Source： Le Journal de Physique IV, Vol.05, Iss.C3, 1995-04, pp. : C3-273-C3-278

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