C−N Bond Formation from a Masked High‐Valent Copper Complex Stabilized by Redox Non‐Innocent Ligands

Publisher： John Wiley & Sons Inc

E-ISSN： 1521-3757|128|36|10870-10874

ISSN： 0044-8249

Source： ANGEWANDTE CHEMIE, Vol.128, Iss.36, 2016-08, pp. : 10870-10874

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