Investigation of bump defects formed in back end of line for 28 nm technological node

Publisher： John Wiley & Sons Inc

E-ISSN： 1096-9918|48|10|1072-1079

ISSN： 0142-2421

Source： SURFACE AND INTERFACE ANALYSIS, Vol.48, Iss.10, 2016-10, pp. : 1072-1079

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