Thermal Joining of Highly Conductive Bonds by Using Reactive Al-Ni Nanofoils

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2016|879|1927-1932

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2016, Iss.879, 2017-02, pp. : 1927-1932

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Abstract