Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

Publisher: Edp Sciences

E-ISSN: 2261-236x|78|issue|01064-01064

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.78, Iss.issue, 2016-10, pp. : 01064-01064

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Abstract