High temperature indentation behavior of eutectic lead-free solder materials

Author： Müllera W.H.  

Publisher： Edp Sciences

E-ISSN： 2100-014x|6|issue|40009-40009

ISSN： 2100-014x

Source： EPJ Web of Conference, Vol.6, Iss.issue, 2010-06, pp. : 40009-40009

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