Modelling crack propagation due to growth stress release in roundwood

Publisher: Edp Sciences

E-ISSN: 1764-7177|105|issue|265-272

ISSN: 1155-4339

Source: Le Journal de Physique IV, Vol.105, Iss.issue, 2003-03, pp. : 265-272

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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