Microstructure evolution and surface cleaning of Cu nanoparticles during micro-forming fields activated sintering technology

Publisher: Edp Sciences

E-ISSN: 2261-236x|21|issue|10002-10002

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.21, Iss.issue, 2015-08, pp. : 10002-10002

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Abstract