Investigation on Thermocompression Bonding Using Lead Free Sinterable Paste and High Lead Solder Paste for Power QFN Application

Publisher： Edp Sciences

E-ISSN： 2261-236x|51|issue|03009-03009

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.51, Iss.issue, 2016-04, pp. : 03009-03009

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