Solving Problem of Thermal Conduction for Providing Strength of Electronic Units on Thermal Impacts

Publisher: Edp Sciences

E-ISSN: 2261-236x|72|issue|01086-01086

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.72, Iss.issue, 2016-08, pp. : 01086-01086

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Abstract