Improvement of the adhesion strength between copper plated layer and resin substrate using a chemically adsorbed monolayer

Publisher： Edp Sciences

E-ISSN： 2261-236x|4|issue|05004-05004

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.4, Iss.issue, 2013-08, pp. : 05004-05004

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