Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

Author： Su Lei   Shi Tielin   Xu Zhensong   Lu Xiangning   Liao Guanglan  

Publisher： MDPI

E-ISSN： 1424-8220|13|12|16281-16291

ISSN： 1424-8220

Source： Sensors, Vol.13, Iss.12, 2013-11, pp. : 16281-16291

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