Author: Stadlbauer Franziska Koch Thomas Archodoulaki Vasiliki-Maria Planitzer Florian Fidi Wolfgang Holzner Armin
Publisher: MDPI
E-ISSN: 1996-1944|6|12|5502-5516
ISSN: 1996-1944
Source: Materials, Vol.6, Iss.12, 2013-11, pp. : 5502-5516
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Via-filling using electroplating for build-up PCBs
By Kobayashi T. Kawasaki J. Mihara K. Honma H.
Electrochimica Acta, Vol. 47, Iss. 1, 2001-09 ,pp. :
Comparison of Fatigue Properties and Fatigue Crack Growth Rates of Various Implantable Metals
Materials, Vol. 5, Iss. 12, 2012-12 ,pp. :