An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant

Author: Song Min-Jae   Kim Kwon-Hee   Yoon Gil-Sang   Park Hyung-Pil   Kim Heung-Kyu  

Publisher: MDPI

E-ISSN: 1996-1944|7|6|4088-4104

ISSN: 1996-1944

Source: Materials, Vol.7, Iss.6, 2014-05, pp. : 4088-4104

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