Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision

Author： Chang Hsuan-Ting   Pan Ren-Jie   Peng Hsiao-Wei  

Publisher： MDPI

E-ISSN： 2075-1702|3|2|72-92

ISSN： 2075-1702

Source： Machines, Vol.3, Iss.2, 2015-04, pp. : 72-92

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